SMT Line
High-speed SMT assembly for fine-pitch components
Capacity 45K CPH
Ceramic PCB Manufacturing Services
Extreme Thermal Performance
Dissipates intensive heat steadily for high-power semiconductor modules.
Superior Insulation Stability
Zero water absorption ensures consistent high-voltage insulation performance.
Precision CTE Matching
Silicon-matched expansion rate reduces thermal cycling stress.
Submit your high-power and high-frequency PCB design files, and our team provides precise DFM optimization and custom ceramic PCB manufacturing solutions.
What is Ceramic PCB?
Ceramic PCB is a high-reliability inorganic substrate circuit board, mainly adopting Alumina (Al₂O₃) and Aluminum Nitride (AlN) materials. Different from FR4 and metal core PCBs, it features zero water absorption, ultra-low thermal expansion and excellent high-temperature resistance, breaking the performance limits of organic substrates in extreme working conditions.
- Graded Ceramic Material Selection
Cost-effective 96%/99.6% alumina for conventional high-power scenarios, and high-performance AlN for ultra-high heat flux and high-frequency precision applications.
- Ultra-Stable Insulation Performance
Inorganic ceramic structure achieves zero water absorption and high dielectric strength, maintaining stable insulation under long-term high temperature and high humidity.
- Low-Stress Thermal Matching
Industry-leading CTE close to silicon chips, effectively reducing solder joint fatigue and cracking during thermal cycling.
Ceramic Substrate Structures
Graded alumina and AlN ceramic structures matching different thermal and precision grade requirements.
Standard 96% Alumina Ceramic PCB
Structural Features
Cost-effective 96% alumina substrate with mature DBC copper plating. It balances reliable insulation and basic thermal performance for cost-sensitive high-power scenarios.
Target Applications
Ordinary high-power LED lighting, low-medium power industrial power supplies
4 Core Advantages of Ceramic PCB
Extreme performance substrates for high-power, high-frequency and long-lifespan electronic systems.
Ceramic PCB Manufacturing Capabilities
Industry-standard graded parameters for alumina and AlN ceramic PCB, covering general power to ultra-high-precision RF & power applications.
 Capability |  Alumina Ceramic PCB (Al₂O₃) |  AlN Ceramic PCB (Aluminum Nitride) |
|---|---|---|
| Min. trace / space | 4/4 mil (fine line routing) | 3/3 mil (ultra-fine precision routing) |
| Supported Layer Count | 1–4 layers (DBC single substrate) | 1–6 layers (LTCC multi-layer custom) |
| Substrate Thickness | 0.25mm–1.0mm standard thickness | 0.2mm–1.5mm full customization |
| Thermal Conductivity | 24–35 W/(m·K) | 170–230 W/(m·K), 6–8× higher than alumina |
| CTE Thermal Expansion | 4.6–5.5 ppm/°C | 2.6–3.5 ppm/°C, silicon-chip matched |
| Min. Laser Via Size | 0.15mm laser microvia | 0.10mm ultra-fine laser microvia |
| Surface Finishes | Thick Film Silver, ENIG, Copper Plating | High-Precision ENIG, Hard Gold, DPC Copper |
| Typical Applications | High-power LED, industrial power supplies, general semiconductor modules | 5G RF communication, automotive power |
Equipment
Advanced production equipment supporting stable quality, capacity, and reliable delivery.
AOI System
Automated visual inspection for defects
Capacity 99.9% Accuracy
X-Ray Inspector
Non-destructive inspection for hidden solder joints
Capacity 10μm Resolution
LDI Machine
Laser direct imaging for high-precision PCB inner layer patterning
Resolution 25 μm / 12 μm
Laminating Press Machine
Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure
Max. Layer 24 Layers
Yongshuo FAQs
Alumina ceramic delivers cost stability for mass production. AlN features superior thermal performance but comes with higher material and processing costs, suitable only for high-end extreme heat-flux projects.
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