SMT Line
High-speed SMT assembly for fine-pitch components
Capacity 45K CPH
RF & Microwave PCB
Low-Dk/Df Materials
Stable low-loss substrates minimize high-frequency signal attenuation.
Precise Impedance Control
Tight tolerance calibration ensures accurate RF impedance matching.
Custom RF Fabrication
Deliver reliable prototyping and mass production for high-frequency PCBs.
Submit your RF stack-up and impedance requirements, and our engineering team provides DFM optimization and low-loss customized PCB solutions.
What is RF & Microwave PCB？
RF & Microwave PCB is a specialized high-frequency circuit board designed for radio frequency and microwave signal transmission. Different from standard FR4 PCBs, it uses low-loss dielectric materials and ultra-precision fabrication processes to reduce insertion loss, return loss and signal phase distortion.
- Low-Loss Dielectric Performance
Uses low Dk/Df substrates to maintain minimal signal attenuation and stable transmission at GHz-level high frequencies.
- Ultra-Precision Impedance Control
Strict line width and layer thickness tolerance ensures accurate impedance matching for RF antenna, filter and transceiver circuits.
- Homogeneous Stack-Up Consistency
Uniform lamination and material flatness prevent frequency offset and signal deviation in high-frequency working scenarios.
Common RF & Microwave PCB Stack-Ups
Graded low-loss stack structures for different frequency bands, from general RF to high-precision microwave applications.
Single-Sided Microstrip
Structural Features
Classic 2-layer microstrip structure with top RF signal traces and full bottom ground plane. It adopts uniform low-loss dielectric, delivering basic stable impedance performance for general low-to-medium frequency RF circuits.
Target Applications
Bluetooth modules, Wi-Fi 2.4G/5G circuits, ordinary IoT wireless boards
4 Core Advantages of RF & Microwave PCB
Stable high-frequency performance to support low-loss, high-precision wireless communication systems.
RF & Microwave PCB Manufacturing Capabilities
Standard mass-production specs and advanced high-end limits for high-frequency and millimeter-wave PCB fabrication.
 Capability Spec |  Standard RF PCB (Consumer & General Industrial) |  Advanced Microwave PCB (High-Frequency & Millimeter-Wave) |
|---|---|---|
| Min. Trace / Space | 4/4 mil | 3/3 mil |
| Supported Frequency Range | DC – 6GHz (Wi-Fi, Bluetooth, 4G LTE) | DC – 40GHz+ (5G Sub-6G, Millimeter-wave, Radar) |
| Matched Stack Structures | Single-sided microstrip, 4-layer symmetric stripline stacks | Multi-ground isolated microwave & hybrid high-frequency custom stacks |
| Max Total Layer Count | 6 Layers | 12 Layers |
| Impedance Control Tolerance | ±5% (Commercial RF Standard) | ±3% (Ultra-Precision Microwave Grade) |
| Available Surface Finishes | OSP, ENIG | ENIG, Immersion Silver, Hard Gold (Low-Roughness RF Grade) |
| High-Frequency Substrates | Low-loss commercial FR4, entry-level RF laminates | Rogers, Isola, Teflon (PTFE), ceramic-filled ultra-low-loss laminates |
Equipment
Advanced production equipment supporting stable quality, capacity, and reliable delivery.
AOI System
Automated visual inspection for defects
Capacity 99.9% Accuracy
X-Ray Inspector
Non-destructive inspection for hidden solder joints
Capacity 10μm Resolution
LDI Machine
Laser direct imaging for high-precision PCB inner layer patterning
Resolution 25 μm / 12 μm
Laminating Press Machine
Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure
Max. Layer 24 Layers
Yongshuo FAQs
Not necessarily. Low-loss FR4 works for low-frequency RF below 6GHz. 5G sub-6GHz and millimeter-wave circuits require Rogers, Isola or PTFE substrates to reduce high-frequency signal loss and phase shift.
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