SMT Line
High-speed SMT assembly for fine-pitch components
Ultra Heat Dissipation
Quickly dissipates heat to protect electronic components.
Stable Heat Conduction
Delivers steady, low-resistance heat transfer performance.
Anti-Deformation Structure
Resists warpage under high temperature and heavy load.
Submit your high-power device PCB design files and thermal dissipation requirements, and our engineering team provides professional DFM optimization and customized metal core PCB solutions.
Metal Core PCB (MCPCB) is a high-efficiency thermal management circuit board with a metal substrate as the base carrier, mainly divided into aluminum core PCB and copper core PCB. Different from standard FR4 PCBs, it adds a metal heat-conducting base and a low-thermal-resistance insulating layer, solving the heat dissipation bottleneck of high-power electronic components.
We adopt cost-effective aluminum for regular heat dissipation scenarios and high-performance copper for ultra-high heat flux precision applications.
Premium dielectric materials greatly reduce thermal resistance, enabling fast and uniform overall heat transfer.
The integrated metal core effectively resists warpage and delamination, ensuring stable long-term high-temperature operation.
Graded aluminum and copper core stack structures matching different heat dissipation grades and power requirements.
Integrated single-sided circuit, insulation and aluminum base structure. With mature craftsmanship and stable basic heat dissipation, it fits most conventional low and medium-power thermal scenarios.
Ordinary LED lighting panels, household lamp boards, low-power drive power supplies
Superior thermal management solutions for high-power electronic equipment stable operation.

Industry-standard graded parameters for aluminum core and copper core PCB, covering conventional lighting to high-power industrial customized thermal solutions.
| | | |
|---|---|---|
| Min. trace / space | 6/6 mil (conventional routing) | 4/4 mil (precision fine routing) |
| Supported Layer Count | 1–2 layers (simple structure) | 1–6 layers (high-density custom) |
| Metal Core Thickness | 1.0mm / 1.6mm fixed standard | 0.8mm–2.0mm fully customizable |
| Thermal Conductivity | 1.0–2.2 W/(m·K) | 3.8–4.5 W/(m·K) (3× higher than Al) |
| Thermal Resistance | ≤0.8 ℃·cm²/W | ≤0.25 ℃·cm²/W (ultra-low heat loss) |
| Min. Drilling Hole Size | 0.65mm (easier aluminum machining) | 1.0mm (hard copper core limitation) |
| Surface Finishes | Solder Mask, OSP, Tin Plating | ENIG, Hard Gold, High-Temp Solder Mask |
| Best Application Scenarios | Best Application Scenarios | High-power automotive, new energy & industrial equipment |
Advanced production equipment supporting stable quality, capacity, and reliable delivery.
High-speed SMT assembly for fine-pitch components
Automated visual inspection for defects
Non-destructive inspection for hidden solder joints
Laser direct imaging for high-precision PCB inner layer patterning
Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure
Select cost-effective aluminum core PCBs for low and medium-power LED lighting and consumer electronics. Choose high-performance copper core PCBs for high-power automotive, new energy and industrial applications requiring ultra-low thermal resistance.
Leave your contact information and project details, we will contact you ASAP!