SMT Line
High-speed SMT assembly for fine-pitch components
Capacity 45K CPH
Flexible PCB Manufacturing Services
Bend & Torsion Resistant
Withstand repeated bending and twisting without internal circuit cracking.
Ultra-Thin Light Design
Minimize device weight and space for compact electronic design.
Flexible Routing Layout
Support irregular routing to break rigid PCB wiring limitations.
Submit your FPC design files and bending requirement specifications, and our engineering team provides DFM optimization and customized flexible circuit manufacturing solutions.
What is Flexible PCB?
Flexible PCB (FPC) is a fully bendable circuit board made of flexible polyimide (PI) dielectric and rolled copper foil. Different from rigid and rigid-flex PCBs, it has no fixed rigid area and can be freely bent, folded, twisted and wound to fit irregular and limited installation spaces.
- Pure Flexible PI Substrate
Adopts high-flexibility, high-temperature-resistant polyimide material to ensure stable circuit performance during long-term repeated bending.
- Multi-Layer Flexible Routing Support
Covers single-sided, double-sided and multi-layer flexible circuit structures, meeting wiring demands from simple connection to high-density precision layout.
- Stress-Free Bending Design
Optimized trace layout and coverlay protection avoid stress concentration, ensuring fatigue resistance and long service life for dynamic bending scenarios.
Common Flexible PCB Stack-Ups
Graded flexible circuit structures for different wiring density, bending frequency and precision requirements.
Single-Layer Flexible PCB
Entry 1-LayerStructural Features
Cost-effective single-sided conductive layer flexible structure with simple routing and excellent basic bending performance. It features mature manufacturability, low material loss and stable electrical conductivity for low-demand connection scenarios.
Target Applications
LED light strip circuits, simple keyboard flexible connections, ordinary sensor signal lines
4 Core Advantages of Flexible PCB
Ultra-flexible circuit solutions to support device miniaturization, lightweight and dynamic bending design.
HDI PCB Manufacturing Capabilities
Quick reference table for prototype, sample, and mass production options. Adjust values per product board type.
 Capability |  Standard Flexible PCB (General Connection) |  Advanced Flexible PCB (High-Precision & Ultra-Thin) |
|---|---|---|
| Min. trace / space | 5/5 mil | 3/3 mil |
| Min. Finished Board Thickness | 0.1mm | 0.05 mm |
| Layer count | 1-2 layers | 4-10 layers |
| Min. Dynamic Bend Radius | 1.0 mm | 0.2 mm |
| Impedance Control Tolerance | ±10% (General signal) | ±5% (Precision signal) |
| Surface Finishes | Gold Plating, Tin Plating | Hard Gold, Immersion Gold, Conductive Adhesive |
Equipment
Advanced production equipment supporting stable quality, capacity, and reliable delivery.
AOI System
Automated visual inspection for defects
Capacity 99.9% Accuracy
X-Ray Inspector
Non-destructive inspection for hidden solder joints
Capacity 10μm Resolution
LDI Machine
Laser direct imaging for high-precision PCB inner layer patterning
Resolution 25 μm / 12 μm
Laminating Press Machine
Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure
Max. Layer 24 Layers
Yongshuo FAQs
The main FPC failure risks are copper trace cracking and coverlay delamination after repeated bending. We use high-toughness rolled copper foil and low-stress PI materials, plus optimized edge routing and stress-relief layout to ensure long-term bending stability.
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