SMT Line
High-speed SMT assembly for fine-pitch components
Capacity 45K CPH
Rigid Flex PCB Manufacturing
Hybrid Rigid-Flex Structure
Integrates rigid soldering zones and flexible bending zones in one unified board.
3D Space-Saving Assembly
Supports folding, twisting and curved installation to reduce overall device size.
High Reliability & Vibration Resistance
Fewer connectors and wiring harnesses improve long-term stability.
Submit your stack-up drawings and design files, and our engineering team delivers customized rigid-flex PCB solutions with full DFM validation.
What is Rigid-Flex PCB?
Rigid-Flex PCB is a hybrid circuit board integrating rigid FR4 sections and flexible polyimide sections in a single unified structure. Unlike pure rigid or flexible PCBs, it retains stable soldering platforms for component mounting while preserving bendable zones for dynamic assembly.
- Hybrid Rigid-Flex Integration
Integrates rigid soldering areas and flexible bending areas into one board to simplify assembly and reduce structural failure points.
- Standard Symmetric Stack Support
Supports full series rigid-flex stack structures including 2+2, 4+4, 6+6, 8+8 symmetric stacks and custom asymmetric structures for diverse mechanical layouts.
- High Mechanical Reliability
Reinforced flexible substrates and stress-relief designs withstand repeated bending, shock and vibration for long-term dynamic service scenarios.
Common Rigid Flex PCB Stack-ups
Customizable rigid-flex stack structures for different bending frequency, density and mechanical reliability requirements.
Symmetric 2+2 Rigid-Flex Stack (Entry Level)
Standard 4-LayerStructural Features
The 2+2 symmetric rigid-flex stack features a simple dual-layer flexible core and balanced outer rigid layers. It delivers stable bending performance, mature manufacturability and cost advantages for basic dynamic layout demands.
Target Applications
Consumer wearables, small household devices, and ordinary sensor modules.
4 Core Advantages of Rigid Flex PCB
Empower compact, shock-resistant and high-reliability electronic products with professional rigid-flex manufacturing technology.
Rigid-Flex PCB Manufacturing Capabilities
Precise manufacturing parameters covering standard and high-end rigid-flex PCB customization for diverse industrial demands.
 Feature |  Standard Rigid-Flex (Symmetric Entry/Mid) |  Advanced Rigid-Flex (High-Density & Custom) |
|---|---|---|
| Min. Trace / Space | 4/4 mil | 3/3 mil |
| Rigid / Flexible Layer Range | 2–4 rigid layers / 2–4 flexible layers | 2–8 rigid layers / 2–8 flexible layers |
| Supported Stack Structures | Symmetric 2+2, 4+4 stacks | Symmetric 6+6, 8+8 & custom asymmetric stacks |
| Min. Flexible Bend Radius | 0.8mm (static bending) | 0.3mm (dynamic frequent bending) |
| Max Total Layer Count | 8 Layers | 16 Layers |
| Min. Finished Board Thickness | 0.5mm | 0.25mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Available Surface Finishes | OSP, ENIG, HASL | ENIG, Hard Gold, Immersion Silver, OSP |
| Supported Substrates | Standard FR4 & Polyimide (PI) | High-Tg FR4, Medical-grade PI, Low-Dk flexible laminates |
Equipment
Advanced production equipment supporting stable quality, capacity, and reliable delivery.
AOI System
Automated visual inspection for defects
Capacity 99.9% Accuracy
X-Ray Inspector
Non-destructive inspection for hidden solder joints
Capacity 10μm Resolution
LDI Machine
Laser direct imaging for high-precision PCB inner layer patterning
Resolution 25 μm / 12 μm
Laminating Press Machine
Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure
Max. Layer 24 Layers
Yongshuo FAQs
Symmetric stacks deliver balanced stress distribution for repeated bending scenarios. Asymmetric custom stacks adapt special installation constraints for irregular structural designs.
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