FR4 PCB Manufacturing

Universal Material Compatibility

Standard FR4 substrate fits most civilian and industrial electronic circuit demands.

Stable Electrical Performance

Consistent dielectric properties ensure reliable signal transmission under conventional working conditions.

Cost-Effective Mass Production

Mature manufacturing process supports high-volume production with stable quality and low unit cost.

Submit your standard and high-Tg FR4 PCB design files, and our team provides professional DFM optimization and customized FR4 PCB manufacturing solutions.

Close-up of a multilayer PCB board highlighting dense traces and via structures.

What is FR4 PCB?

FR4 PCB is the most widely used rigid circuit board in the electronics industry, adopting glass fiber reinforced epoxy resin as the core substrate material. Featuring excellent flame retardancy, mechanical rigidity and electrical insulation, it serves as the standard substrate for most consumer, industrial and automotive electronic products. Standard FR4 and high-Tg FR4 PCBs deliver balanced performance in insulation, mechanical strength and process adaptability. They support single-sided, double-sided and multi-layer customized circuits, covering basic consumer electronics, industrial control systems, communication devices and automotive civilian electronic modules.

  • Graded FR4 Material Selection

    Standard FR4 for conventional consumer and commercial products, high-Tg FR4 for high-temperature and long-term continuous operation industrial scenarios.

  • Reliable Insulation & Flame Retardancy

    UL94 V0 flame-retardant grade prevents combustion spread, maintaining stable insulation and safety in daily and industrial operating environments.

  • Excellent Mechanical Stability

    High rigidity and anti-bending strength resist mechanical stress and deformation, ensuring long-term structural stability of circuit boards.

Common FR4 PCB Substrate Structures

Graded standard and high-Tg FR4 structures matching different temperature resistance and reliability requirements.

Standard Single & Double-Sided FR4 PCB

Entry-Level

Structural Features

Basic single/double-sided FR4 boards with simple routing, mature production process and ultra-high cost performance, suitable for low-complexity circuit design.

Target Applications

Ordinary consumer electronics, household appliances, simple control modules and low-power civilian devices.

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4 Core Advantages of FR4 PCB

Versatile, cost-stable and high-reliability substrates for mainstream electronic manufacturing.

FR4 PCB Manufacturing Capabilities

Complete graded production parameters for standard and high-Tg FR4 PCB, covering civilian, commercial and industrial-grade applications.

Capability Spec Standard FR4 PCB High-Tg FR4 PCB
Min. trace / space 5/5 mil (standard routing) 3/3 mil (fine precision routing)
Supported Layer Count 1–8 layers (standard multi-layer) 1–12 layers (high-density multi-layer)
Substrate Thickness 2–16 layers 2–16 layers
Tg Temperature 130°C–140°C conventional grade 170°C–180°C high-temperature resistant grade
Thermal Stability Suitable for normal temperature continuous operation Resists frequent thermal cycling and high-load heat impact
Min. Laser Via Size 0.2mm standard microvia 0.10mm ultra-fine laser microvia
Surface Finishes HASL, Lead-free HASL, ENIG, OSP High-precision ENIG, Hard Gold, Immersion Silver
Typical Applications Household appliances, consumer electronics, commercial control devices Industrial automation, automotive electronics, outdoor high-load equipment

Equipment

Advanced production equipment supporting stable quality, capacity, and reliable delivery.

SMT Line

High-speed SMT assembly for fine-pitch components

Capacity 45K CPH

AOI System

Automated visual inspection for defects

Capacity 99.9% Accuracy

X-Ray Inspector

Non-destructive inspection for hidden solder joints

Capacity 10μm Resolution

LDI Machine

Laser direct imaging for high-precision PCB inner layer patterning

Resolution 25 μm / 12 μm

Laminating Press Machine

Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure

Max. Layer 24 Layers

Yongshuo FAQs

Standard FR4 is cost-effective for normal-temperature consumer products. High-Tg FR4 features higher temperature resistance and thermal stability, avoiding deformation and layer delamination under high-temperature and thermal cycling conditions for industrial and automotive scenarios.

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