SMT Line
High-speed SMT assembly for fine-pitch components
Universal Material Compatibility
Standard FR4 substrate fits most civilian and industrial electronic circuit demands.
Stable Electrical Performance
Consistent dielectric properties ensure reliable signal transmission under conventional working conditions.
Cost-Effective Mass Production
Mature manufacturing process supports high-volume production with stable quality and low unit cost.
Submit your standard and high-Tg FR4 PCB design files, and our team provides professional DFM optimization and customized FR4 PCB manufacturing solutions.
FR4 PCB is the most widely used rigid circuit board in the electronics industry, adopting glass fiber reinforced epoxy resin as the core substrate material. Featuring excellent flame retardancy, mechanical rigidity and electrical insulation, it serves as the standard substrate for most consumer, industrial and automotive electronic products. Standard FR4 and high-Tg FR4 PCBs deliver balanced performance in insulation, mechanical strength and process adaptability. They support single-sided, double-sided and multi-layer customized circuits, covering basic consumer electronics, industrial control systems, communication devices and automotive civilian electronic modules.
Standard FR4 for conventional consumer and commercial products, high-Tg FR4 for high-temperature and long-term continuous operation industrial scenarios.
UL94 V0 flame-retardant grade prevents combustion spread, maintaining stable insulation and safety in daily and industrial operating environments.
High rigidity and anti-bending strength resist mechanical stress and deformation, ensuring long-term structural stability of circuit boards.
Graded standard and high-Tg FR4 structures matching different temperature resistance and reliability requirements.
Basic single/double-sided FR4 boards with simple routing, mature production process and ultra-high cost performance, suitable for low-complexity circuit design.
Ordinary consumer electronics, household appliances, simple control modules and low-power civilian devices.
Versatile, cost-stable and high-reliability substrates for mainstream electronic manufacturing.

Complete graded production parameters for standard and high-Tg FR4 PCB, covering civilian, commercial and industrial-grade applications.
| | | |
|---|---|---|
| Min. trace / space | 5/5 mil (standard routing) | 3/3 mil (fine precision routing) |
| Supported Layer Count | 1–8 layers (standard multi-layer) | 1–12 layers (high-density multi-layer) |
| Substrate Thickness | 2–16 layers | 2–16 layers |
| Tg Temperature | 130°C–140°C conventional grade | 170°C–180°C high-temperature resistant grade |
| Thermal Stability | Suitable for normal temperature continuous operation | Resists frequent thermal cycling and high-load heat impact |
| Min. Laser Via Size | 0.2mm standard microvia | 0.10mm ultra-fine laser microvia |
| Surface Finishes | HASL, Lead-free HASL, ENIG, OSP | High-precision ENIG, Hard Gold, Immersion Silver |
| Typical Applications | Household appliances, consumer electronics, commercial control devices | Industrial automation, automotive electronics, outdoor high-load equipment |
Advanced production equipment supporting stable quality, capacity, and reliable delivery.
High-speed SMT assembly for fine-pitch components
Automated visual inspection for defects
Non-destructive inspection for hidden solder joints
Laser direct imaging for high-precision PCB inner layer patterning
Multilayer PCB lamination press for bonding inner cores and prepregs under heat and pressure
Standard FR4 is cost-effective for normal-temperature consumer products. High-Tg FR4 features higher temperature resistance and thermal stability, avoiding deformation and layer delamination under high-temperature and thermal cycling conditions for industrial and automotive scenarios.
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